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M.P.C. has been working
extensively on the correlation between the electrochemical behavior of
a solution under specific current conditions and its performances for
electroplating applications.
M.P.C. originally designed a
specific approach to better understand pulse plating and the effects
of pulse currents onto solutions for electroplating.
With our experience, we are
now able to predict the plating performances of an electroplating bath
under specific conditions of currents and voltage, as well as the
influence of additives on those plating performances.
We also studied the impact of
insoluble anodes in the electroplating environment and designed with a
well known anode manufacturer a new generation of insoluble anodes
with revolutionary caracteristics.
Our range of applications goes
from the copper electrodeposition on printed circuits boards under PPR
to the deposition of pure tin using pulse current in the electronics
industry.
M.P.C. is a provider of
material and equipment for the realization and the implementation of
those new technologies.
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