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Our Analytical
Instrument, the TITRAPLATE® , is part of a new generation
of equipment to control your plating baths.
It has been
particularly designed to answer the needs of the chemical suppliers
for plating applications but also for their customers using their
plating baths.
We have a wide
range of experience working with several type of chemistry going from
acid copper electroplating in the Printed Circuits or Microelectronics
fields to the tin, tin-lead or tin-alloy plating for the Electronics
applications.
Based on the
Cyclic Voltammetry Stripping analytical method (C.V.S.), it presents
all the necessary features to make automatic or manual analysis of
your plating baths but propose also an additional panel of new
electrochemical techniques to enhance the analytical methods used for
the determination of additives concentration in plating baths. |
